Dear Customer,

TDK uses its abundant experience and technology that it has accumulated to propose a new mounting method for the next generation.
TDK is proud to introduce its new high-reliable, space-saving, low price equipment: AFM-15 Flip Chip Bonder (Ultrasonic Bonding Process).

Low-energy bonding enables bonding with 30% to 50% less energy consumption than other companies' products

Primary Applications

Key Features

• For High Precision Cost-Sensitive Applications
  All in one process for mounting and bonding
• High Speed and Accuracy Mounting
  Speed: 0.8 sec/IC Chip Component
  Accuracy: +/- 8µmt
• Small Footprint: 1.7 Square Meters
• Easy Operation with Color Touch Screen
• Inspection of Known Good Die from wafer
• Capable to handle FR4, Ceramic or Silicon

Basic Structure

Comparison of Mounting Technology

Future Development

Downloads:

AFM-15 Characteristics
Summarized AFM-15 Information (PDF)

AFM-15 & AFM Series Product Details
AFM-15, MDM-20 Product Details (PDF)